A chiplet is a small semiconductor die designed to be combined with other dies inside one package. Instead of building one large monolithic chip, engineers can mix and match chiplets for compute, memory, input-output, or accelerator functions. This approach can improve manufacturing yield, packaging flexibility, and performance by shortening some on-package data paths.
In cyber security, chiplets matter because they create more trust boundaries inside a single device. Each die, interconnect, and package layer can become part of the attack surface, especially if the system depends on firmware, proprietary links, or third-party supply chains. Defenders care about integrity checks, secure boot, signed microcode, and robust validation of die-to-die communication. Attackers may target weak interconnects, hidden components, or manufacturing defects to disrupt systems or expose data.